Interdiffusion along grain boundaries can lead to shift of grain boundaries in form of Grain
Boundary Diffusion Induced Grain Boundary Migration, DIGM, in systems forming wide …

Void formation in the Cusingle bondSn system has been identified as a major reliability
issue with small volume electronic interconnects. Voids form during the interdiffusion of …

Transient liquid phase bonding (TLPB) is a promising technology for three-dimensional
integration of circuits (3D IC), but it can be slow and less productive. A novel Cu-Sn …

The requirements for electronic devices in high-temperature environment such as avionics
and automotive have promoted the development of high-temperature solders. The Au–20Sn …

The current chip-level Au-Sn solder production process is very complex, to simplify the
process while improving the quality of the solder, Au-20Sn solder ribbon was prepared by …

Three critical experiments, including Sn interlayer thickness optimization, interfacial IMC
growth evolution, and bump size effect, have been conducted for low temperature Cusingle …

The solid state diffusion-controlled growth of the phases is studied for the Au–Sn system in
the range of room temperature to 200° C using bulk and electroplated diffusion couples. The …

In this paper, we investigated the microstructure evolution and the resulting change in
mechanical properties in a Ag@ Sn TLP bondline during reflow and thermal aging. A Ag …

The multiple reflow reliability of Au-20 wt% Sn solder has attracted great interests in
optoelectronic and high power electronic industries. But the growing dendrite in the solder …

High reliable packaging materials are needed for electronics when they work at harsh
environments. Among which, the nanosilver material has been widely studied and applied in …