Surface structure of C/C composites has been regulated through electrochemical corrosion
at room temperature to modify the residual stress and improve the joining strength when …

In the current study, the effect of the weight percentage of filler and additive powder on the
microstructural and mechanical properties of the wide gap activated diffusion brazing …

The strategy of bonding high-entropy alloys (HEAs) is of vital significance for producing
complex engineering components available to extreme conditions. In this work, transient …

Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for
high-temperature electronic packaging applications since their inception. A comparative …

Wide gap transient liquid phase (TLP) bonding could be used for repairing large cracks or
worn areas on aerospace components. Unfortunately, the residual borides in the joints after …

In this study, transient liquid-phase (TLP) bonding of SiC and GH3536 was employed using
Cu80Ti15Ni5 (at%) mixed powder. The melting characteristics of the filler materials were …

Transient liquid phase (TLP) bonding of Inconel 718 with BNi-2 filler metal has traditionally
been carried out using thin filler metal (narrow gap) to achieve complete eutectic-free …

Laser beam offset welding of GH3128 and molybdenum (Mo) dissimilar joints was studied
with an emphasis on the role of laser beam offset (LBO). It was found that the change of LBO …

In recent times, sintered brazing preform is used in the TLP bonding applications as it only
undergoes partial melting during bonding, thus preserving its designed geometries. In this …

The capability to join various metallic and non-metallic materials is crucial to the production
of a wide array of components across many industries, ranging from the soldering of small …