Logic circuit with indium nitride quantum well

M Radosavljevic, S Dasgupta, HW Then… - US Patent …, 2023 - Google Patents
2019-02-19 Assigned to INTEL CORPORATION reassignment INTEL CORPORATION
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

High dynamic range receiver integrated into a chip package

DS Jansen - US Patent 10,778,270, 2020 - Google Patents
A communications receiver. One example embodiment is a system-in-package (SIP) device,
which includes a three-dimensional interposer, a first bandpass filter integrated into the …

Semiconductor device and method for manufacturing the same

DU Ziming, LI Changan, W Du… - US Patent App. 17 …, 2024 - Google Patents
2022-03-03 Assigned to INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD. reassignment
INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS …

Method of operating semiconductor device

S Ikuo, Y Kawano - US Patent 11,719,745, 2023 - Google Patents
A semiconductor device includes: a substrate; a circuit element disposed on a first surface
side of the substrate; a first transmission line disposed on the first surface side; a first …

Semiconductor device and semiconductor module

S Ikuo, Y Kawano - US Patent 11,506,707, 2022 - Google Patents
(57) ABSTRACT A semiconductor device includes: a substrate; a circuit element disposed
on a first surface side of the substrate; a first transmission line disposed on the first surface …

Integration of passive components in III-N devices

N Nidhi, R Ramaswamy, HW Then… - US Patent …, 2023 - Google Patents
(57) APSTRACT Disclosed herein are integrated circuit structures, packages, and devices
that include resistors and/or capacitors which may be provided on the same …