A survey on split manufacturing: Attacks, defenses, and challenges
In today's integrated circuit (IC) ecosystem, owning a foundry is not economically viable, and
therefore most IC design houses are now working under a fabless business model. In order …
therefore most IC design houses are now working under a fabless business model. In order …
Pin accessibility-driven detailed placement refinement
The significantly increased number of routing design rules at sub-20nm nodes has made pin
access one of the most critical challenges in detailed routing. Resolving pin access issues in …
access one of the most critical challenges in detailed routing. Resolving pin access issues in …
Overlay-aware detailed routing for self-aligned double patterning lithography using the cut process
Self-aligned double patterning (SADP) is one of the most promising techniques for sub-
20nm technology. Spacer-is-dielectric SADP using a cut process is getting popular because …
20nm technology. Spacer-is-dielectric SADP using a cut process is getting popular because …
Directed self-assembly cut mask assignment for unidirectional design
Recently, directed self-assembly (DSA) has emerged as a promising lithography solution for
cut manufacturing. We perform a comprehensive study on the DSA aware mask optimization …
cut manufacturing. We perform a comprehensive study on the DSA aware mask optimization …
Directed self-assembly based cut mask optimization for unidirectional design
Unidirectional design has attracted lots of attention with the scaling down of technology
nodes. However, due to the limitation of traditional lithography, printing the randomly …
nodes. However, due to the limitation of traditional lithography, printing the randomly …
Layout decomposition co-optimization for hybrid e-beam and multiple patterning lithography
As the feature size keeps scaling down and the circuit complexity increases rapidly, a more
advanced hybrid lithography, which combines multiple patterning and electron-beam …
advanced hybrid lithography, which combines multiple patterning and electron-beam …
Double-patterning aware DSA template guided cut redistribution for advanced 1-D gridded designs
ZW Lin, YW Chang - Proceedings of the 2016 on International …, 2016 - dl.acm.org
Directed self-assembly (DSA) technology has emerged as a promising candidate for cut
printing in advanced 1-D gridded layouts, where cuts might need to be redistributed such …
printing in advanced 1-D gridded layouts, where cuts might need to be redistributed such …
Cut Redistribution With Directed-Self-Assembly Templates for Advanced 1-D Gridded Layouts
ZW Lin, YW Chang - … on Computer-Aided Design of Integrated …, 2017 - ieeexplore.ieee.org
Directed-self-assembly (DSA) technology is a promising candidate for cut printing in sub-
10nm 1-D gridded designs, where cuts might need to be redistributed such that they could …
10nm 1-D gridded designs, where cuts might need to be redistributed such that they could …
ILP-based co-optimization of cut mask layout, dummy fill, and timing for sub-14nm BEOL technology
Self-aligned multiple patterning (SAMP), due to its low overlay error, has emerged as the
leading option for 1D gridded back-end-of-line (BEOL) in sub-14nm nodes. To form actual …
leading option for 1D gridded back-end-of-line (BEOL) in sub-14nm nodes. To form actual …
Making split fabrication synergistically secure and manufacturable
Split fabrication is a promising approach to security against attacks by untrusted foundries.
While existing split fabrication methods consider the overhead of conventional objectives …
While existing split fabrication methods consider the overhead of conventional objectives …