Ferroelectric liquid crystal over silicon smart pixels offers potential advantages over
conventional electronic and waveguide approaches to telecommunications switching. The …

57 ABSTRACT A multichip module having high density optical and elec trical
interconnections between integrated circuit chips includes a Substrate overlaying an array of …

We explore the possibility of enhancing very large scale integration (VLSI) electronic switch
structures using reconfigurable freespace optical chip-to-chip interconnects. We present a …

In contrast to volume holographic material where 1-to-many fanouts are realized using
multiplexed volume holograms, we report in this paper the first Si-based surface-relief …

Future advances in the application of photonic interconnects will involve the insertion of
parallel-channel links into Multi-Chip Modules (MCMs) and board-level parallel connections …

As multichip modules (MCMs) grow in chip count and complexity, increasingly large
numbers of input/output (I/O) channels will be required for connection to other MCMs or …

A coplanar refractive–diffractive doublet array employing surface-relief diffractive phase
elements embedded within poly (methyl methacrylate) microlenses is introduced as an …

In this paper we focus on the design of optically interconnected MCMs for gigabit ATM
switching networks. Our approach is to design a generic hardware module that can be used …

We describe the potential impact of liquid crystal technology when integrated with VLSI
memory to allow optical access, an approach currently under development within this …

In this paper, we present a MCM chip to chip optical interconnect layer in which
optoelectronic devices are integrated onto a glass light-guiding substrate. Rather than …