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A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology
Y Sun, J Wang, X Zhang, C Yang, A Hu, T Hang… - Electronic Materials …, 2021 - Springer
Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with
Controllable Morphology | Electronic Materials Letters Skip to main content Springer Nature …
Controllable Morphology | Electronic Materials Letters Skip to main content Springer Nature …
Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
Fabrication, characterization, and thermomechanical reliability of electroplated Cu-Sn-Cu-
based transient liquid phase (TLP) bonding required in microsystems packaging are …
based transient liquid phase (TLP) bonding required in microsystems packaging are …
Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling
H Guo, L Zhang, L Yin - Microelectronics Reliability, 2022 - Elsevier
In order to investigate the influence of roughness on the evolution of interfacial intermetallic
compounds (IMCs) and stress states at the micro-solder joints under the strongly coupled …
compounds (IMCs) and stress states at the micro-solder joints under the strongly coupled …
Effect of substrate surface roughness on interfacial reaction at Sn-3.0 Ag/(001) Cu interface
C Dong, M Shang, H Ma, Y Wang, H Ma - Vacuum, 2022 - Elsevier
The high reliability of solder joints is the guarantee for the miniaturization, ultra-high density,
multi-functional and high performance of integrated chips. The growth of interfacial …
multi-functional and high performance of integrated chips. The growth of interfacial …
Formation of through-wafer 3-D interconnects in fused silica substrates by electrochemical discharge machining
In recent years, the usage of glass-based materials as substrate in radio-frequency (RF)
micro-electro-mechanical-systems (MEMS) applications has increased. Compared to silicon …
micro-electro-mechanical-systems (MEMS) applications has increased. Compared to silicon …
Void formation in low-temperature electroplated Cu-Sn stack for hermetic packaging
Electrodeposited Cu-Sn based solid-liquid interdiffusion (SLID) bonding is a popular
technique used for the hermetic encapsulation in various MEMS applications. However, the …
technique used for the hermetic encapsulation in various MEMS applications. However, the …
Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
MS Luo, HG Wang, B Chen, GC Lyu… - 2023 24th …, 2023 - ieeexplore.ieee.org
The past decade has seen increasing attention to Cu–Sn solid-liquid interdiffusion (SLID)
bonding technology, which can be applied to achieve bonding at a low temperature and the …
bonding technology, which can be applied to achieve bonding at a low temperature and the …