Flexible electronics has significantly advanced over the last few years, as devices and
circuits from nanoscale structures to printed thin films have started to appear …

Ultrathin wafers, which enable the low-aspect-ratio through-silicon vias to be formed easily,
are indispensable for bumpless three-dimensional (3D) stacking. To clarify thinning-induced …

This paper is to develop and investigate a wafer thinning process model (WTPM) to integrate
the wafer thickness into set-up parameters and predict total thickness variation (TTV) of …

The demand for advanced packaging is driven by the need for low-profile, densely-
integrated, large-die Si devices in substrate-based or wafer-level packaging. Die strength is …

Short-wave infrared (SWIR) imaging has a wide range of applications in civil and military
fields. Over the past two decades, significant efforts have been devoted to develo** high …

The objective of this study is to evaluate the existing test methods of die strength, including
widely-accepted three-point and four-point bending tests, and a newly-proposed point-load …

Coronally uneven terrain, a common yet challenging feature encountered in daily
ambulation, exposes individuals to an increased risk of falling. The foot-ankle complex may …

The ball-on-ring (BOR) and three-point bending (3PB) tests were used in this paper to
characterize the effect of the dicing process on the fracture strength of Si dies. Dies prepared …

Atmospheric-pressure (AP) plasma sources have attracted researchers in many engineering
fields, due to its low cost and easy handling. The AP plasma technique has been …

Purpose The purpose of this paper was to investigate how variations in the geometry of
silicon chips and the presence of surface defects affect their static bending properties. By …