The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-
free solders, and on the formation of intermetallic layer of the solders with Cu substrate were …

Presently, interfacial intermetallic compounds play a vital role in determining the reliability of
solder joints due to their intrinsic mechanical property. Especially for Zn–Al solder joints, the …

The results of experimental studies of melting and crystallization of Bi-Sn eutectic alloy on
carbon, bismuth and tin substrates are presented. Bi-Sn layered films with different mass …

Abstract As-cast Sn-8.8 wt.% Zn eutectic alloy was directionally solidified with a constant
temperature gradient (G= 4.16 K/mm) under various solidification rates (V= 8.3–790 μm/s) in …

The study includes the results of research conducted on selected lead-free binary solder
alloys designed for operation at high temperatures. The results of qualitative and …

In this work, contact angle, spreading area, and isothermal aging tests were conducted to
study the difference between Sn-3Ag-0.5 Cu lead-free solder and its composite solder at …

Zinc-Aluminum (ZA) alloys are important industrial alloys which are gaining widespread use
for many industrial applications due to their excellent castability and cutting machinability …

Bu çalışmada, Sn91. 2-x-Zn8. 8-Agx x= ağ.% 0.15, 0.3, 0.7, 1.0, 3.0, 10.0 alaşımları vakumlu
eritme fırını ve döküm fırını kullanılarak hazırlandı. Daha sonra numuneler sabit fırın …