Ever-increasing complexity in high-speed electronic devices and systems presents
significant computational challenges in the numerical analysis in terms of desired accuracy …

In this paper, W-band flip-chip-assembled CMOS chip modules with transition compensation
are presented, a three-stage amplifier, a balanced amplifier, and a down-converted Gilbert …

A novel all-in-polymer multichip module (MCM-P) process is presented for applications at D-
band (110-170 GHz). The unique manufacturing approach is an additive 3-D printing …

With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave
point-to-point networking has the potential to fill a niche in communications network …

The world, as we know it today, at the end of the second decade of the twenty-first century, is
a world in which everybody and everything is connected. In the past several years, the …

This letter presents a W-band micromachined air-cavity bandpass filter (BPF) using a novel
integration method of a micromachined silicon air-cavity resonator with silicon pillars. With …

We developed a chip mounting technology suitable for low-cost assemblies in the 300-500-
GHz frequency range, compatible with standard chip and submount fabrication techniques …

This paper presents a flip-chip structure based on carbon nanotube (CNT) interconnected
bumps for high-frequency applications. The CNT bumps are grown directly on gold coplanar …

In this letter, a W-band air-cavity filter has been developed on a thin-film substrate using a
lossy silicon substrate as a base plate, which is suitable for a mm-wave system-on-package …

A multilayer transition and balanced power divider are presented for millimeter-wave system-
on-package (SoP). These two components operate at Ka-band and exploit the substrate …