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Advancements and challenges in ultra-thin vapor chambers for high-efficiency electronic thermal management: A comprehensive review
F Zhou, J Zhou, X Huai - International Journal of Heat and Mass Transfer, 2023 - Elsevier
Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …
and high performance, resulting in electronic chips generating significant heat in a confined …
Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview
Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …
management devices for cooling the high heat flux miniaturized power electronic devices …
[HTML][HTML] Capillary-fed, thin film evaporation devices
Evaporation plays a critical role in a range of technologies that power and sustain our
society. Wicks are widely used as passive, capillary-fed evaporators, attracting much interest …
society. Wicks are widely used as passive, capillary-fed evaporators, attracting much interest …
Recent advances in the optimization of evaporator wicks of vapor chambers: From mechanism to fabrication technologies
X Cheng, G Yang, J Wu - Applied Thermal Engineering, 2021 - Elsevier
For the challenge of cooling hotspots in the burgeoning electronics/optoelectronics
equipment, vapor chambers provide a promising solution based on a distinctive passive two …
equipment, vapor chambers provide a promising solution based on a distinctive passive two …
A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance
With the rapid development of the economy and society, the contradiction between energy
supply and the deterioration of the ecological environment has become increasingly …
supply and the deterioration of the ecological environment has become increasingly …
Performance comparative evaluation of three thin vapor chambers with different wick structures
F Zhou, G Zhou, J Zhou, X Jia, X Huai - Applied Thermal Engineering, 2023 - Elsevier
Enhancing the performance of cooling modules is crucial for mitigating the heat dissipation
problem of high-power-density electronic devices and simultaneously improving the energy …
problem of high-power-density electronic devices and simultaneously improving the energy …
Heat transfer enhancement of spray cooling by copper micromesh surface
Spray cooling has become one of the most promising heat dissipation technologies for
thermal management of super high heat flux. The traditional strategies to enhance spray …
thermal management of super high heat flux. The traditional strategies to enhance spray …
Enhanced capillary-driven thin film boiling on cost-effective gradient wire meshes for high-heat-flux applications
F Zhou, J Zhou, X Li, Q Chen, X Huai - Experimental Thermal and Fluid …, 2023 - Elsevier
As high-power electronics continue to advance rapidly, the pursuit of efficient thermal
management has emerged a critical challenge for their further high-performance and large …
management has emerged a critical challenge for their further high-performance and large …
Liquid film boiling enabled ultra-high conductance and high flux heat spreaders
Many of the advanced technologies, eg, microprocessors, laser and radar, and power
transmitters and amplifiers, are becoming increasingly dependent on the ability to dissipate …
transmitters and amplifiers, are becoming increasingly dependent on the ability to dissipate …
Superhydrophilic catenoidal aluminum micropost evaporator wicks
We introduce the superhydrophilic catenoidal aluminum (Al) wicks fabricated by a multi-step
wet etching process followed by wet chemical oxidation. The unique three-dimensional …
wet etching process followed by wet chemical oxidation. The unique three-dimensional …