Advancements and challenges in ultra-thin vapor chambers for high-efficiency electronic thermal management: A comprehensive review

F Zhou, J Zhou, X Huai - International Journal of Heat and Mass Transfer, 2023 - Elsevier
Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview

BL Rakshith, LG Asirvatham, AA Angeline… - … and Sustainable Energy …, 2022 - Elsevier
Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

[HTML][HTML] Capillary-fed, thin film evaporation devices

G Vaartstra, L Zhang, Z Lu, CD Díaz-Marín… - Journal of Applied …, 2020 - pubs.aip.org
Evaporation plays a critical role in a range of technologies that power and sustain our
society. Wicks are widely used as passive, capillary-fed evaporators, attracting much interest …

Recent advances in the optimization of evaporator wicks of vapor chambers: From mechanism to fabrication technologies

X Cheng, G Yang, J Wu - Applied Thermal Engineering, 2021 - Elsevier
For the challenge of cooling hotspots in the burgeoning electronics/optoelectronics
equipment, vapor chambers provide a promising solution based on a distinctive passive two …

A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance

H Jiang, X Wang, C Ding, D Shan, B Guo, H Qi… - International Journal of …, 2024 - Elsevier
With the rapid development of the economy and society, the contradiction between energy
supply and the deterioration of the ecological environment has become increasingly …

Performance comparative evaluation of three thin vapor chambers with different wick structures

F Zhou, G Zhou, J Zhou, X Jia, X Huai - Applied Thermal Engineering, 2023 - Elsevier
Enhancing the performance of cooling modules is crucial for mitigating the heat dissipation
problem of high-power-density electronic devices and simultaneously improving the energy …

Heat transfer enhancement of spray cooling by copper micromesh surface

Y Hu, Y Lei, X Liu, R Yang - Materials Today Physics, 2022 - Elsevier
Spray cooling has become one of the most promising heat dissipation technologies for
thermal management of super high heat flux. The traditional strategies to enhance spray …

Enhanced capillary-driven thin film boiling on cost-effective gradient wire meshes for high-heat-flux applications

F Zhou, J Zhou, X Li, Q Chen, X Huai - Experimental Thermal and Fluid …, 2023 - Elsevier
As high-power electronics continue to advance rapidly, the pursuit of efficient thermal
management has emerged a critical challenge for their further high-performance and large …

Liquid film boiling enabled ultra-high conductance and high flux heat spreaders

X Li, S Wang, R Wen, X Ma, R Yang - Cell Reports Physical Science, 2022 - cell.com
Many of the advanced technologies, eg, microprocessors, laser and radar, and power
transmitters and amplifiers, are becoming increasingly dependent on the ability to dissipate …

Superhydrophilic catenoidal aluminum micropost evaporator wicks

S Bang, S Ryu, S Ki, K Song, J Kim, J Kim… - International Journal of …, 2020 - Elsevier
We introduce the superhydrophilic catenoidal aluminum (Al) wicks fabricated by a multi-step
wet etching process followed by wet chemical oxidation. The unique three-dimensional …