Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …

Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

Polymers are usually considered thermal insulators, because the amorphous arrangement
of the molecular chains reduces the mean free path of heat-conducting phonons. The most …

Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport
applications, known as thermal interface materials (TIMs), have been impeded by their …

Room-temperature liquid metals (LMs) are attractive candidates for thermal interface
materials (TIMs) because of their moderately high thermal conductivity and liquid nature …

The miniaturization, integration, and high data throughput of electronic chips present
challenging demands on thermal management, especially concerning heat dissipation at …

Controlling the anisotropy of two-dimensional materials with orientation-dependent heat
transfer characteristics is a possible solution to resolve severe thermal issues in future …

Vertically aligned carbon nanotube (VACNT) arrays are considered a promising candidate
for a thermal interface material (TIM) due to their good stability, high thermal conductivity …

Increasing power densities within microelectronic systems place an ever increasing demand
on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at …