Automated Design Flow for Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging

Turnitin 降AI改写 早检测系统 早降重系统 Turnitin-UK版 万方检测-期刊版 维普编辑部版 Grammarly检测 Paperpass检测 checkpass检测 PaperYY检测

Board Level Reliability Study on Large Antenna-in-Package Solutions for Automotive Radar Applications

K Meier, M Schaulin, C Götze… - 2022 IEEE 24th …, 2022 - ieeexplore.ieee.org
In this paper, the analysis of the board level reliability of a Radar package continuously
studied in parallel to its progressing design development will be presented. In general, the …
Save Cite Cited by 2 Related articles

Development Of Low Dielectric Loss Polyimides And Fabrication Of Advanced Packagings For 5g ApplicationS

T Fujiwara, Y Tatsuta, K Matsumura… - 2020 International …, 2020 - ieeexplore.ieee.org
Recently we have developed novel polyimide adhesive sheet materials (PI sheet) which
have advantages such as planarization, via-filling, low shrinkage (low stress) during curing …
Save Cite Cited by 2 Related articles