The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …

This work investigates the effect of Fe and Bi addition, 0.05 wt.% Fe and 1 wt.% or 2 wt.% Bi,
on the microstructural, mechanical, and thermal properties of the low silver Sn–1Ag–0.5 Cu …

The effect of aluminum concentration on the microstructure, wettability, interfacial IMC and
mechanical properties of Sn–0.7 Cu lead-free solder alloy is investigated. The results show …

In this study, the new Fe/Bi-bearing Sn-1Ag-0.5 Cu (SAC105) solder alloys were studied for
their mechanical properties, including impact toughness, hardness and shear strength …

Abstract Cerium (Ce)-containing Sn-3.9 Ag-0.7 Cu alloy exhibits desirable attributes of
microstructural refinement, increased ductility, and mechanical shock performance, while …

Cu‐Sn based alloy powders with additives of elemental Pb or C were densified by hot
pressing technique. The influence of densifying on the properties of the hot pressed …

The effect of aluminum on the microstructure and mechanical properties of Sn–0.7 Cu–xAl
(x= 0–0.075) solder alloy is investigated. The results show that the microstructure of Sn–Cu …

In this study, an ultrasonic nanocrystal surface modification (UNSM) was used to enhance
mechanical properties of CuSn10Pb10 alloy. Top surface coarse grains were refined into …

In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-
1Ag-0.5 Cu (SAC105) lead-free solder alloys were prepared and their microstructure and …

A novel alloying elements of TeFeCoBi have been anticipated to modify Sn–3Ag–0.7 Cu
SAC (307) alloys in various attributes. This study inspects the influence of slight/trace …