Abstract For the common Cu-Sn interconnection system in microelectronics packaging, a
significant concern is the sporadic interfacial void formation within the Cu–Sn interface and …

The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0. 5Cu/Cu
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …

Kirkendall voids are detrimental to the Cu-Sn bonding interface, causing the failure of the
high-density package. Herein, the perpendicularly aligned nanotwinned Cu (p-ntCu) and the …

Abstract Intermetallic compound (s)(IMC) that nucleates at the interface between solder and
Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic …

Void formation in the Cu single bond Sn system has been identified as a major reliability
issue with small volume electronic interconnects. Voids form during the interdiffusion of …

Electrodeposition of Cu metallization and its soldering reaction with solder alloy are of
technological significance in microelectronic packaging industry. This study aims to …

In this paper, the effect of stress states on the damage behavior of Sn-based solder
connection in an IGBT discrete during thermal cycling (− 40° C to 160° C) was investigated …

Electrodeposition of Cu receives considerable attention due to its wide application in
microelectronic products. Sn-rich alloys are commonly used to join the electroplated Cu to …

Copper (Cu) electroplating is a cost-effective and scalable technology used to fabricate
interconnects/metallizations in microelectronic products. Liquid-phase soldering reactions …

This article presents Cu/diamond composite coatings produced by electrochemical
reduction on steel substrates and a comparison of these coatings with a copper coating …