[HTML][HTML] State of the art and future perspectives in advanced CMOS technology

HH Radamson, H Zhu, Z Wu, X He, H Lin, J Liu… - Nanomaterials, 2020 - mdpi.com
The international technology roadmap of semiconductors (ITRS) is approaching the
historical end point and we observe that the semiconductor industry is driving …

CMOS scaling for the 5 nm node and beyond: Device, process and technology

HH Radamson, Y Miao, Z Zhou, Z Wu, Z Kong, J Gao… - Nanomaterials, 2024 - mdpi.com
After more than five decades, Moore's Law for transistors is approaching the end of the
international technology roadmap of semiconductors (ITRS). The fate of complementary …

[HTML][HTML] Miniaturization of CMOS

HH Radamson, X He, Q Zhang, J Liu, H Cui, J **ang… - Micromachines, 2019 - mdpi.com
When the international technology roadmap of semiconductors (ITRS) started almost five
decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) …

Si and SiGe nanowire for micro-thermoelectric generator: a review of the current state of the art

Y Li, G Wang, M Akbari-Saatlu, M Procek… - Frontiers in …, 2021 - frontiersin.org
In our environment, the large availability of wasted heat has motivated the search for
methods to harvest heat. As a reliable way to supply energy, SiGe has been used for …

The challenges of advanced CMOS process from 2D to 3D

HH Radamson, Y Zhang, X He, H Cui, J Li, J **ang… - Applied Sciences, 2017 - mdpi.com
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit
bricks in integrated circuits (ICs) have constantly changed during the past five decades. The …

[KNYGA][B] FinFET devices for VLSI circuits and systems

SK Saha - 2020 - taylorfrancis.com
To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged
as the real alternative for use as the next generation device for IC fabrication technology …

Epitaxial deposition of doped semiconductor materials

M Bauer - US Patent 7,863,163, 2011 - Google Patents
Disclosed herein are exemplary embodiments of improved methods for performing selective
epitaxial deposition of semiconductor materials, including in situ carbon-doped …

High performance junctionless FDSOI SiGe channel p-FinFET with high ION/IOFF ratio and excellent SS

H Lin, X Zhao, X Luo, Y Miao, Y Zhang, Z Kong… - Materials Science in …, 2024 - Elsevier
This paper presents a novel FDSOI FinFETs with SiGe channel/Si cap layer (35 nm/5 nm)
formed on SOI wafers with 20 nm Si body. Electrical characterization result shows that JL …

Integration of highly-strained SiGe materials in 14 nm and beyond nodes FinFET technology

G Wang, A Abedin, M Moeen, M Kolahdouz, J Luo… - Solid-State …, 2015 - Elsevier
SiGe has been widely used as stressors in source/drain (S/D) regions of Metal–Oxide-
Semiconductor Field Effect Transistor (MOSFET) to enhance the channel mobility. In this …

Selective epitaxy growth of Si1−xGex layers for MOSFETs and FinFETs

HH Radamson, M Kolahdouz - Journal of Materials Science: Materials in …, 2015 - Springer
This article reviews the selective epitaxy growth of intrinsic, B-and C-doped SiGe layers on
recessed (or flat) exposed Si areas for MOSFETs as well as on Si-fins for FinFETs. A …