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[HTML][HTML] State of the art and future perspectives in advanced CMOS technology
The international technology roadmap of semiconductors (ITRS) is approaching the
historical end point and we observe that the semiconductor industry is driving …
historical end point and we observe that the semiconductor industry is driving …
CMOS scaling for the 5 nm node and beyond: Device, process and technology
HH Radamson, Y Miao, Z Zhou, Z Wu, Z Kong, J Gao… - Nanomaterials, 2024 - mdpi.com
After more than five decades, Moore's Law for transistors is approaching the end of the
international technology roadmap of semiconductors (ITRS). The fate of complementary …
international technology roadmap of semiconductors (ITRS). The fate of complementary …
[HTML][HTML] Miniaturization of CMOS
HH Radamson, X He, Q Zhang, J Liu, H Cui, J **ang… - Micromachines, 2019 - mdpi.com
When the international technology roadmap of semiconductors (ITRS) started almost five
decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) …
decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) …
Si and SiGe nanowire for micro-thermoelectric generator: a review of the current state of the art
In our environment, the large availability of wasted heat has motivated the search for
methods to harvest heat. As a reliable way to supply energy, SiGe has been used for …
methods to harvest heat. As a reliable way to supply energy, SiGe has been used for …
The challenges of advanced CMOS process from 2D to 3D
HH Radamson, Y Zhang, X He, H Cui, J Li, J **ang… - Applied Sciences, 2017 - mdpi.com
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit
bricks in integrated circuits (ICs) have constantly changed during the past five decades. The …
bricks in integrated circuits (ICs) have constantly changed during the past five decades. The …
[KNYGA][B] FinFET devices for VLSI circuits and systems
SK Saha - 2020 - taylorfrancis.com
To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged
as the real alternative for use as the next generation device for IC fabrication technology …
as the real alternative for use as the next generation device for IC fabrication technology …
Epitaxial deposition of doped semiconductor materials
M Bauer - US Patent 7,863,163, 2011 - Google Patents
Disclosed herein are exemplary embodiments of improved methods for performing selective
epitaxial deposition of semiconductor materials, including in situ carbon-doped …
epitaxial deposition of semiconductor materials, including in situ carbon-doped …
High performance junctionless FDSOI SiGe channel p-FinFET with high ION/IOFF ratio and excellent SS
H Lin, X Zhao, X Luo, Y Miao, Y Zhang, Z Kong… - Materials Science in …, 2024 - Elsevier
This paper presents a novel FDSOI FinFETs with SiGe channel/Si cap layer (35 nm/5 nm)
formed on SOI wafers with 20 nm Si body. Electrical characterization result shows that JL …
formed on SOI wafers with 20 nm Si body. Electrical characterization result shows that JL …
Integration of highly-strained SiGe materials in 14 nm and beyond nodes FinFET technology
SiGe has been widely used as stressors in source/drain (S/D) regions of Metal–Oxide-
Semiconductor Field Effect Transistor (MOSFET) to enhance the channel mobility. In this …
Semiconductor Field Effect Transistor (MOSFET) to enhance the channel mobility. In this …
Selective epitaxy growth of Si1−xGex layers for MOSFETs and FinFETs
HH Radamson, M Kolahdouz - Journal of Materials Science: Materials in …, 2015 - Springer
This article reviews the selective epitaxy growth of intrinsic, B-and C-doped SiGe layers on
recessed (or flat) exposed Si areas for MOSFETs as well as on Si-fins for FinFETs. A …
recessed (or flat) exposed Si areas for MOSFETs as well as on Si-fins for FinFETs. A …