Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability

L Cheng, P Gupta, C Spanos, K Qian, L He - Proceedings of the 46th …, 2009 - dl.acm.org
Modeling spatial variation is important for statistical analysis. Most existing works model
spatial variation as spatially correlated random variables. We discuss process origins of …

Deep Learning-Based Partial Inductance Extraction of 3-D Interconnects

X Jia, M Wang, Q Dai, CF Wang… - IEEE Journal on …, 2025 - ieeexplore.ieee.org
A physics-informed deep learning-based scheme is introduced for computing partial
inductances of interconnects. This scheme takes a physics-based skin depth map and a …

[PDF][PDF] Energy-performance characterization of CMOS/magnetic tunnel junction (MTJ) hybrid logic circuits

F Ren - 2010 - researchgate.net
The explosive growth of the semiconductor industry over the past decade has been driven
by the rapid scaling of complementary metal-oxide-semiconductor (CMOS) technology …

On confidence in characterization and application of variation models

L Cheng, P Gupta, L He - 2010 15th Asia and South Pacific …, 2010 - ieeexplore.ieee.org
In this paper we study statistics of statistics. Statistical modeling and analysis have become
the mainstay of modern design-manufacturing flows. Most analysis techniques assume that …