Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review
The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …
components with ever higher integration level, packaging density, and power density, which …
Rheology and printability: A survey of critical relationships for direct ink write materials design
Abstract Direct Ink Write (DIW) is a material extrusion Additive Manufacturing (AM) technique
that selectively extrudes material in a layer-by-layer fashion to form 3-dimensional parts …
that selectively extrudes material in a layer-by-layer fashion to form 3-dimensional parts …
[HTML][HTML] Processing, thermal conductivity and flame retardant properties of silicone rubber filled with different geometries of thermally conductive fillers: A comparative …
YT Li, WJ Liu, FX Shen, GD Zhang, LX Gong… - Composites Part B …, 2022 - Elsevier
With the development of highly integrated and miniaturized electronic devices, silicone
rubber composites with good mechanical flexibility, high thermal conductivity and excellent …
rubber composites with good mechanical flexibility, high thermal conductivity and excellent …
Polymer composite with enhanced thermal conductivity and mechanical strength through orientation manipulating of BN
Herein, we report a fabrication of epoxy resin/oriented BN composites via a facile hot-
pressing strategy. Benefitting from the force exerted vertically on the BN platelets, a well …
pressing strategy. Benefitting from the force exerted vertically on the BN platelets, a well …
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …
Recent advances in polymer-based electronic packaging materials
High-density integration and packaging technologies are highly desired to integrate more
functionality into a smaller form factor with improved performance, in which the polymer …
functionality into a smaller form factor with improved performance, in which the polymer …
[HTML][HTML] Fused filament fabrication of stainless steel structures-from binder development to sintered properties
Additive manufacturing of metals by 3D printing of polymeric filaments containing high
loading of metal powder, subsequent debinding, and sintering offers a potent alternative to …
loading of metal powder, subsequent debinding, and sintering offers a potent alternative to …
A general approach to composites containing nonmetallic fillers and liquid gallium
We report a versatile method to make liquid metal composites by vigorously mixing gallium
(Ga) with non-metallic particles of graphene oxide (GO), graphite, diamond, and silicon …
(Ga) with non-metallic particles of graphene oxide (GO), graphite, diamond, and silicon …
[HTML][HTML] Production and characterization of Graphene Nanoplatelet-based ink for smart textile strain sensors via screen printing technique
Wearable systems are becoming highly attractive in different application areas. Recently,
particular attention has been focused on the development of personal portable devices for …
particular attention has been focused on the development of personal portable devices for …
Rheology and thermomechanical evaluation of additively manufactured acrylonitrile butadiene styrene (ABS) with optimized tungsten carbide (WC) nano-ceramic …
Tungsten carbide (WC), a superhard and thermally stable ceramic, is widely used in several
industries. Its exceptional features portray WC as a promising reinforcement and stabilizing …
industries. Its exceptional features portray WC as a promising reinforcement and stabilizing …