Abstract Direct Ink Write (DIW) is a material extrusion Additive Manufacturing (AM) technique
that selectively extrudes material in a layer-by-layer fashion to form 3-dimensional parts …

The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

With the development of highly integrated and miniaturized electronic devices, silicone
rubber composites with good mechanical flexibility, high thermal conductivity and excellent …

Graphene and their derivatives exhibit interesting properties (mechanical properties,
electrical and thermal conductivities). When incorporated into polymer matrices, many …

The rapid development of additive manufacturing, also known as three-dimensional (3D)
printing, is driving innovations in both industry and academia. Direct ink writing (DIW), an …

Polymer materials are multiscale systems by definition. Already the description of a single
macromolecule involves a multitude of scales, and cooperative processes in polymer …

High-density integration and packaging technologies are highly desired to integrate more
functionality into a smaller form factor with improved performance, in which the polymer …

Herein, we report a fabrication of epoxy resin/oriented BN composites via a facile hot-
pressing strategy. Benefitting from the force exerted vertically on the BN platelets, a well …

Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …

Additive manufacturing of metals by 3D printing of polymeric filaments containing high
loading of metal powder, subsequent debinding, and sintering offers a potent alternative to …