Abstract Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …

The extended finite element method enhances the approximation properties of the finite
element space by using additional enrichment functions. But the resulting stiffness matrices …

Abstract Solders based on Sn-Ag alloys are susceptible to microstructural coarsening during
storage or service, resulting in evolution of joint properties, and hence reliability, over time …

This study investigates composite lead-free solders fabricated by adding between 0.5 and
3wt% of Ni particles in situ to Sn–3.5 wt% Ag lead-free solder. The single lap shear strength …

Purpose–The purpose of this paper is to investigate the microstructural development of
SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling …

This study compares the high-Ag-content Sn-3Ag-0.5 Cu with the low-Ag-content Sn-1Ag-
0.5 Cu solder alloy and the three quaternary solder alloys Sn-1Ag-0.5 Cu-0.1 Fe, Sn-1Ag …

The effects of Al addition on the microstructural stability and mechanical properties of Sn–
1Ag–0.5 Cu (wt.%) solder alloy under high-temperature aging were investigated. The …

Sn-Ag-based solders are susceptible to appreciable microstructural coarsening due to the
combined effect of thermal and mechanical stimuli during service and storage. This results in …

This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips
with Cu contact-pads on the front side and a die attach film on the backside are picked and …

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during
storage or service. This results in evolution of joint properties over time and thereby …