With a rising emphasis on public safety and quality of life, there is an urgent need to ensure
optimal air quality, both indoors and outdoors. Detecting toxic gaseous compounds plays a …

Wire bonding is an interconnection technique widely used in semiconductor packaging.
Certain packages employ a stacked die configuration for miniaturization. Thus, the …

The aim of this study was to develop a flexible package technology using laser-assisted
bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to …

Purpose The purpose of this paper was to investigate how variations in the geometry of
silicon chips and the presence of surface defects affect their static bending properties. By …

In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The
sensor tag combines three different environmental sensors in one single platform for the …

Recent advances in IC integration technologies have evolved computing techniques and
chip development worldwide in wearables, flexible, and stretchable electronics for human …

In this subject, thermosonic flip-chip technology was introduced to conduct low-temperature
bonding of Ag paste and chip interconnection experiments with micro solder joints. The …

In this paper, ultra-thin die handling process and stress-less dicing are presented in the
trend of light, thin, short and small semiconductor packages. As always there are pros and …

Abstract Tin-Silver-Copper (SAC) solder was recognized as the preferable for lead-free
solder composition, while electroless nickel/immersion gold (ENIG) was recognized as the …

Electronic packaging is traditionally defined as the back‐end process that transforms bare
integrated circuits (IC) into functional products. To be precise, electronic packaging is an …