Recent advances in nano-materials for packaging of electronic devices
S Zhang, X Xu, T Lin, P He - Journal of Materials Science: Materials in …, 2019 - Springer
In recent years, Moore's law had a remarkable effect on predicting the development of
semiconductor technology. As the size of devices shrinks to micro scale or nano scale, Intel's …
semiconductor technology. As the size of devices shrinks to micro scale or nano scale, Intel's …
Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0 Ag-0.5 Cu composite solder joints
H Wang, X Hu, X Jiang - Materials Characterization, 2020 - Elsevier
A composite solder was prepared by adding different amount Ni modified multi-walled
carbon nanotubes (MWCNTs) into the Sn-3.0 Ag-0.5 Cu (SAC305) solder. Experiments were …
carbon nanotubes (MWCNTs) into the Sn-3.0 Ag-0.5 Cu (SAC305) solder. Experiments were …
Development and applications of embedded passives and interconnects employing nanomaterials
The advent of nanotechnology has initiated a profound revolution in almost all spheres of
technology. The electronics industry is concerned with the ongoing miniaturization of …
technology. The electronics industry is concerned with the ongoing miniaturization of …
Mechanical properties are affected by coalescence mechanisms during sintering of metal powders: Case study of Al-Cu nanoparticles by molecular dynamics …
In the present study, molecular dynamics simulation is utilized to explore atomic-scale
evolution during the solid-state sintering of Al-Cu nanoparticles (NPs). Our main goal is to …
evolution during the solid-state sintering of Al-Cu nanoparticles (NPs). Our main goal is to …
[HTML][HTML] Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale
Due to the excellent electrothermal properties, outstanding resistance to electromigration
and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for …
and cost-effectiveness, Cu nanoparticles are considered as a promising bonding material for …
Atomic fast dynamic motion on the Cu nanoparticle's surface before melting: A molecular dynamics study
Z Song, W Luo, X Fan, Y Zhu - Applied Surface Science, 2022 - Elsevier
The Cu nanoparticle solder owns a broad potential application prospect for the ultra-fine
pitch interconnection. It is reported that the Cu nanoparticles can be sintered at about 500 …
pitch interconnection. It is reported that the Cu nanoparticles can be sintered at about 500 …
[BUCH][B] Nanopackaging: Nanotechnologies and electronics packaging
JE Morris - 2018 - Springer
Level one electronics packaging is traditionally defined as the design and production of the
encapsulating structure that provides mechanical support, environmental protection …
encapsulating structure that provides mechanical support, environmental protection …
Laser sintering of printed anodes for al-air batteries
We report on a 3D printed Al anode for Al-air battery combined with laser sintering method.
We verified that laser sintering contributed to effective removal of the organic solvent in the …
We verified that laser sintering contributed to effective removal of the organic solvent in the …
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0. 3Ag0. 7Cu-CNTs solder
Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100
nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the …
nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the …
Fabrication and sintering behavior of nano Cu–Ag composite paste for high-power device
W Lv, J Liu, Y Mou, Y Ding, M Chen… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Cu and Ag nanoparticle (NP) paste has emerged as a promising choice for high-power
devices because of its excellent thermal and electrical properties. However, easy oxidation …
devices because of its excellent thermal and electrical properties. However, easy oxidation …