Over the last decade, lasers have been gradually employed for Si wafer dicing to replace
blade dicing. Laser dicing has the potential to replace blade dicing as the future generation …

This work studies in detail the effect of femtosecond laser irradiation process parameters
(fluence and scanning speed) on the hydrophobicity of the resulting micro/nano-patterned …

We present an experimental study on the drilling of metal targets with ultrashort laser pulses
at high repetition rates (from 50 kHz up to 975 kHz) and high average powers (up to 68 …

The influence of pulse duration on the laser drilling of metals at repetition rates of up to 1
MHz and average powers of up to 70 W has been experimentally investigated using an …

Laser cutting is a promising alternative to the traditional methods in CFRP cutting. However,
laser cutting is based on thermal interaction that results in thermal damages of both matrix …

Micromachining thin metal films coated on glass are widely used to repair semiconductor
masks and to fabricate optoelectrical and MEMS devices. The interaction of lasers and …

Ultrashort pulsed lasers offer a high potential in precise and efficient material processing
and deep understanding of the fundamental laser-material interaction aspects is of great …

In this paper, we demonstrate that laser patterning of organic solar cells by ultrafast laser
systems (pulse length< 350 fs) is an attractive process to produce photovoltaic modules with …

An experimental investigation into the specific point energy (E SP), cutting volume efficiency
(α Vol) and material removal rate (MRR) in laser cutting of two different polyester composites …

The dependence of ablation rate of an Al alloy on laser beam spot size (10–150 µm) was
investigated using an ArF excimer laser operating at a wavelength of 193 nm and pulse …