Effect of temperature on joint quality in wave soldering of Sn-9Zn-2.5 Bi-1.5 In lead-free solder alloy

V Duk, A Ren, G Zhang - Microelectronic Engineering, 2024 - Elsevier
Snsingle bondZn (tin‑zinc) solder has been regarded as a promising lead-free solder
material with a low melting point of 198° C, serving as a suitable alternative to both Snsingle …

Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering

R Seidel, T Ahrens, J Friedrich, A Reinhardt… - Microelectronics …, 2022 - Elsevier
Mini wave soldering is a common method for soldering through-hole components on printed
circuit boards (PCB). With PCB design becoming increasingly complex and copper layer …

Protección de la máquina de inducción mediante su modelo térmico

CF Naula Morocho, ID Lituma Pintado - 2024 - dspace.ups.edu.ec
En este proyecto, se desarrolla un modelo térmico para la máquina de inducción de rotor
devanado, junto con la determinación de los parámetros correspondientes, a partir de …

Effect of Temperature on Joints Quality in Wave Soldering of Sn-9zn-2.5 bi-1.5 in Alloy

DUK Vichea, G ZHANG, A REN - Available at SSRN 4696427 - papers.ssrn.com
Abstract Sn-Zn (tin-zinc) solder is a low temperature lead-free solder which possesses
favorable characteristics such as reliability, high conductivity, and good wettability …