A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
[HTML][HTML] Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150° C
In this work, a low-temperature wafer-level bonding process at 150° C was carried out on Si
wafers containing 10 µm-sized microbumps based on the Cu-Sn-In ternary system …
wafers containing 10 µm-sized microbumps based on the Cu-Sn-In ternary system …
Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
Fabrication, characterization, and thermomechanical reliability of electroplated Cu-Sn-Cu-
based transient liquid phase (TLP) bonding required in microsystems packaging are …
based transient liquid phase (TLP) bonding required in microsystems packaging are …
Finite element simulation of solid–liquid interdiffusion bonding process: Understanding process-dependent thermomechanical stress
Solid–liquid interdiffusion (SLID) bonding finds a wide variety of potential applications
toward die-attach, hermetic encapsulation of microelectromechanical systems (MEMS) …
toward die-attach, hermetic encapsulation of microelectromechanical systems (MEMS) …
[HTML][HTML] Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
This work demonstrates the potential use of Cu-Sn-In metallurgy for wafer-level low-
temperature solid-liquid interdiffusion (LT-SLID) bonding process for …
temperature solid-liquid interdiffusion (LT-SLID) bonding process for …
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
The trend for heterogeneous integration has driven the need for a low-temperature bonding
process. Cu-Sn-In based solid-liquid interdiffusion (SLID) bonding technology has been …
process. Cu-Sn-In based solid-liquid interdiffusion (SLID) bonding technology has been …
Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding
Based on the finite element (FE) simulations done in this work, lowering the bonding
temperature significantly decreases the bonding induced residual stresses. Therefore, low …
temperature significantly decreases the bonding induced residual stresses. Therefore, low …
Demonstrating 170° C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding
The wafer-level solid liquid interdiffusion (SLID) bonds carried out for this work take
advantage of the Cu–In–Sn ternary system to achieve low-temperature interconnections …
advantage of the Cu–In–Sn ternary system to achieve low-temperature interconnections …
Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents
C Wang, T Chang - Journal of Electronic Materials, 2024 - Springer
This study investigated the interfacial reactions between Co and In-Sn solders, with various
compositions, up to 90 at% Sn, at 350° C, with the aim of evaluating their potential for use in …
compositions, up to 90 at% Sn, at 350° C, with the aim of evaluating their potential for use in …
Low-temperature Metal Bonding for Optical Device Packaging
Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the
packaging of optical devices. It reduces global residual stress build up caused by …
packaging of optical devices. It reduces global residual stress build up caused by …