Mechanical performance is one of the most important factors influencing the reliability of
solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints …

A new unified creep‐plasticity (UCP) constitutive model coupled with damage is proposed
for Sn–3.0 Ag–0.5 Cu (SAC305), one of the most successfully commercialized Pb‐free …

在先进封装中器件小型化的趋势下, 焊点所处的服役环境越加苛刻, 这对焊点材料提出了更高的
可靠性要求. 为保证微小尺寸焊点的可靠性, 具有较**扩散阻挡能力的铁镍 …

The experimental and multi-scale numerical investigation for solder ball under shear loads
is studied in the present work. Shear tests are conducted on Sn-1.0 Ag-0.5 Cu solder balls at …

Influences of shear amplitude and joint height on fatigue lifetime and fracture behavior of
Cu/Sn–3.0 Ag–0.5 Cu/Cu joints with increasing current density were investigated. The …

A hybrid method was developed in this study for fatigue life prediction (FLP) of lead-free
solder (LFS) joints in ball grid array package under the coupled electrical–thermal …

In this study, a reliability analysis and life prediction of solder joints for avionics devices with
immersion cooling under random vibration by considering the effect of coupled electrical …

With the rapid development of miniaturization and high integration for electronic
components, the increasing current density and Joule heat put a great challenge on the …

In this study, the low cycle shear fatigue performance and fracture behavior of microscale
ball grid array (BGA) structure Cu/Sn–3.0 Ag–0.5 Cu/Cu solder joints with various shear …