As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

This review presents a comprehensive analysis of the recent formulation of nanoparticle-
reinforced solder alloys, focusing on their main properties and improvements in mechanical …

With the trends of miniaturization and high density of electronic packaging, there has been
an urgent demand to open up lead-free solders with high strength and ductility. In this study …

Purpose This study aims to investigate the influence of different solder alloy materials on
passive devices during laser soldering process. Solder alloy material has been found to …

Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT)
addition on microstructure, interfacial intermetallic compound (IMC) layer and …

Laser soldering is becoming more popular for soldering pin through-hole (PTH) components
onto printed circuit boards (PCBs). Solder volume influences soldering joint reliability …

Intermetallic compound (IMC) growth is being analyzed due to its significant effect on solder
joint reliability. It appears that from various works conducted whereby the excessive growth …

Gamma radiation plays an important role in changing the properties and behavior of the
materials. In this present work, the correlation between the intermetallic compound (IMC) …

Purpose Reflow solder joint quality is significantly affected by the ability of the solder to
perfectly fill pad space and retain good solder joint shape. This study aims to investigate …

Purpose This study aims to investigate the design configuration for an optimum solder height
of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology …