Recently, the need for miniaturization and high integration have steered a strong technical
wave in develo** (micro‐) electronic devices. However, excessive amounts of heat may …

The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …

Miniaturized and high‐power‐density 3D electronic devices pose new challenges on
thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is …

The low intrinsic thermal conduction and high dielectric properties of epoxy resins have
significantly limited their applications in electrical and electronic devices with high …

Thermal conductivity is critical to the stable operation, service life and reliability of electronic
equipment. Solving thermal management problems in electronic devices requires the …

Numerous researches have drawn on the polymer-based thermal conductive composites to
cope with heat dissipation issue both in the integrated electronics and human body …

Achieving a delicate balance between fire resistance and thermal conductivity in
intumescent flame-retarded polypropylene (PP) poses a formidable challenge, primarily due …

The escalating demands of high-frequency applications demands the development of
dielectric materials with low relative permittivity (dielectric constant) for efficient signal …

The sharp reduction in size and increase in power density of next‐generation integrated
circuits lead to electromagnetic interference and heat failure being a key roadblock for their …

With the rapid improvement of microelectronics integration and assembly technology, the
increasing heat flux density in electronic devices puts forward higher requirements for …