Peripheral such as aerospace, armor, sensors, heat exchanger, automobile, storage, and
any other electronic equipment are frequently subjected to varying mechanical and thermal …

High thermal conductivity, structural stability, good mechanical and anti-oxidant properties
makes hexagonal boron nitride (h-BN) a promising functional filler for polymers to produce …

Electro-active polymers (EAPs) are emerging as feasible materials to mimic muscle-like
actuation. Among EAPs, dielectric elastomer (DE) devices are soft or flexible capacitors …

The continuing miniaturization of electronic devices and the increasing power output of
electrical equipment have created new challenges in packaging and insulating materials …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

In recent years, extensive efforts have been devoted to electronic miniaturization and
integration. Accordingly, heating up of electronics has become a critical problem that needs …

Lightweight nanocomposites with superior thermal transport properties promise great
application potential,[1–4] for which there has been extensive development effort.[5–8] …

Polydimethylsiloxane (PDMS)—the simplest and most common silicone compound—
exemplifies the central characteristics of its class and has attracted tremendous research …

Silicone rubber has excellent mechanical properties and thermal stability and is widely used
in aerospace, mechanical manufacturing, and high-temperature sealing. However, with the …

The purpose of this review article is to summarize previous research works done on polymer
composites filled with various types of nitride compounds for potential applications, specially …