The recent advances and trends in heterogeneous integrations are presented in this study.
Emphasis is placed on:(A) the definition of heterogeneous integrations,(B) the classifications …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

This paper describes Cu direct bonding at room temperature for wearable micro-LED
display. Still, the conventional bonding methods of micro-LEDs with solder micro-bumps …

High-performance stretchable electronics are attracting great attention due to the
mechanical adaptability, but are still limited to achieving highly-integrable, high density, high …

We describe a Fan-Out Wafer-Level Packaging (FOWLP) integration process that is used to
build an extremely flexible heterogeneous integration platform called" FlexTrateTM". We …

We demonstrate a fully integrated wireless surface electromyography (sEMG) system using
Fan-Out Wafer-Level Packaging on a flexible biocompatible package with two corrugated …

Silicon interconnect fabric (Si-IF) is a wafer-scale heterogeneous integration platform. This
platform promotes a paradigm shift in system integration and packaging methods, providing …

This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC
chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS …

This study presents an innovative packaging scheme for an implantable medical device
which is an episcleral surface stimulator applying trans-scleral electrical stimulation. The …

To improve the flexibility of Li-ion batteries for powering wearables, we develop a simple
battery interconnection method on FlexTrate™ to fabricate a thin-film flexible Li-ion battery …