In the big data era, Si chips are integrated more and more to satisfy the fast growing demand
from customers. In addition, in the post-COVID-19 virus era, the trend of distance teaching …

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …

This study investigates the shear strength and aging characteristics of Sn-3.0 Ag-0.5 Cu
(SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle …

In pursuit of functionality and miniaturization in electronics, 3D integrated packaging
requires low-temperature solders. This study explores a novel low-temperature lead-free …

In this paper, the influence of 0.01-0.05 wt.% hexagonal boron nitride (BN) nanoparticle
do** on the microstructure and shear properties of Sn58Bi composite solder joints was …

High entropy alloy (HEA) receives noticeable attention in the electronic industry, and one of
the best ways to incorporate HEA with the existing assembly setup is to reinforce HEA …

To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA)
solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro-and nano-particles with a …

As a widely adopted candidate in the modern electric industry, much attention has been paid
to SnBi solder alloy. However, the intrinsic brittleness of this alloy hinders its further …

As chip technology faces increasing difficulty and cost in development, scaling for
integration density is slowing down. 3D integration technology has emerged as a solution to …

基于单晶格点原子占位几率描述相变过程的微扩散相场模型, 从原子尺度上研究了Ni59Al22V19
中熵合金的异相界面结构与相变过程中合金微观组织演化. 结果表明: Ni59Al22V19 …