A circuitized structure with a 3-dimensional configuration. A base structure is provided that
includes an insulating substrate of electrically insulating material with a flat configuration …

A power electronics module includes a frame, a jet im**ement cooler assembly, and a
power electronics assembly. The frame includes a first surface, a second surface, a power …

Tamper-respondent assemblies and methods of fabrication are provided which include an
inner enclosure, a tamper-respondent sensor (s), a protective wrap (s) and an outer …

In a power Supply unit, a printed circuit board is provided on which two or more different-
shape components are mounted. Such components include semiconductor devices. The …

Electronic packages are provided with enhanced heat dissipation capabilities. The
electronic package includes a plurality of electronic components, and an enclosure in which …

Tamper-proof electronic packages and fabrication methods are provided including an
enclosure enclosing, at least in part, at least one electronic component within a secure …

US PATENT DOCUMENTS 4.322, 737 A 3/1982 Sliwa, Jr. 4,392,153 A 7/1983 Glascock, II
et al. 4.420, 739 A 12/1983 Herren 4,494,171 A 1, 1985 Bland et al. 4,733,293 A 3, 1988 …

Enhanced heat transferassemblies and jet im**ement cool ing apparatuses having target
Surfaces with Surface fins and microslots are disclosed. In one embodiment, an enhanced …

Manufacturing electronic packages is provided with enhanced heat dissipation capabilities.
The method includes providing a plurality of electronic components, and an enclosure in …

A cooling assembly comprises an electronic component, a thermal spreader, a cold plate,
and a phase change thermal capacitor. The thermal spreader conducts heat freely between …