[HTML][HTML] Recent developments in advanced polymeric materials for solder mask application: Progress and challenges

WYL Lim, M Jaafar, KMK Ishak, K Chinniah… - Journal of Science …, 2023 - Elsevier
With the miniaturization of electronic components and higher density of electrical
connections in the printed circuit boards, the properties of conventional solder masks are …

Key materials in solder mask ink for printed circuit board

H Zhou, Y Song - ChemistrySelect, 2024 - Wiley Online Library
Solder mask ink (SMI) layer can avoid the short circuit between electronic component and
land for the fabrication of printed circuit board (PCB). More importantly, the layer not only …

Photo-Cross-Linked Acrylate Resins Enabled by Tuning Various Flexible Diamine-Extended Species for High-Performance Printed Circuit Board Coatings

Y He, S Yang, P Tian, J Zhang - ACS Applied Polymer Materials, 2024 - ACS Publications
The arrival of the 5G era requires that the solder resist coating of electronic chips involved in
high-frequency communication technology has more promising comprehensive properties …

High-Adhesion Epoxy-Based Solder Resist Dry Film for Integrated Circuits Enhanced by 2, 2-Bis (hydroxymethyl) propionic Acid

J Zhang, T Wang, X Lv, S Zhang, J Li… - ACS Applied Polymer …, 2024 - ACS Publications
The increasing demand for high performance and miniaturization of electronic devices
creates an urgent need for solder resist materials with excellent comprehensive properties …

Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing

Z Liang, X Wang, L Feng, X Wu - Journal of Applied Polymer …, 2019 - Wiley Online Library
ABSTRACT A novel solder resist ink for inkjet printing containing the ultraviolet (UV) and
thermal dual curing oligomer is introduced in this work. Three kinds of acrylic monomers for …

Characterization of commercial solder mask in printed circuit board application

WYL Lim, M Mariatti, KI Ku Marsilla, WK Chan… - Asian Workshop on …, 2022 - Springer
Solder mask (SM) has been widely utilized in the printed circuit board (PCB) to prevent
solder bridging and to passivate against the outer environment. In the PCB assembly …

Effect of hyperbranched polymer as toughener on tensile, thermal and electrical properties of thin film epoxy composites

WYL Lim, M Jaafar, KMK Ishak, WK Chan… - Journal of Physics …, 2024 - iopscience.iop.org
Due to the intrinsic brittleness of epoxy-based solder masks (SMs), hyperbranched polymers
have emerged as potential alternatives for permanent SMs. However, the low glass …

Thermal Decomposition Kinetic Analysis and Performance Characterization of Low Dk/Df Ink based on Polyurethane Acrylate

ZL **ao, Q Liu, C Zeng, DX Wu, LB Song, Z Cao… - Protection of Metals and …, 2020 - Springer
Thermal analysis and Fourier transform infrared spectroscopy were used to investigate the
thermal stability of two low-dielectric constant (D k)/dielectric loss (D f) inks based on …

元素杂化阻燃丙烯酸树脂的研究进展

崔锦峰, 郭永亮, 邵竟尧, 杨保**, 郭军红 - **塑料, 2016 - plaschina.com.cn
元素杂化阻燃丙烯酸树脂的研究进展 **塑料 首页 关于本刊 本刊介绍 编委会 本刊荣誉 数据库
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[인용][C] 聚氨酯丙烯酸酯复配油墨的热分解动力学研究

肖忠良, 刘青, 曾超, 吴道新, 宋刘斌, 曹忠, 黄勇 - 湖南师范大学自然科学学报, 2020