Tin–lead solder alloys are widely used in the electronic industry. They serve as
interconnects that provide the conductive path required to achieve connection from one …

In the past few decades, increasing demands for electrically conductive adhesives (ECAs)
have led to growing interest in the design and development of innovative strategies to obtain …

Compared with traditional solder joint bonding, an anisotropic conductive adhesive (ACA)
provides an efficient and simple method for the interconnection of small-scale electronics …

A general analytical expression for the size-dependent constriction (contact) resistance is
obtained for non-quantum contacts of arbitrary size as a solution of Laplace's equation with …

Recently, the flip-chip bonding technology using adhesives has been widely used in the
packaging industry because of environmental friendliness (elimination of lead material and …

Dispensable isotropic conductive adhesives (ICA) and snap-curing anisotropic conductive
adhesives (ACA) are developed through the EC funded Brite EuRam project DACTEL# …

In this study, we incorporated micro-silver flakes and nano-hexagonal boron nitride (BN)
particles into a matrix resin to prepare electrically conductive adhesives (ECAs). The humid …

A nanoindentation-based flat punch method has been developed to determine the stress–
strain behaviour of single micron-sized Ugelstad polystyrene-co-divinylbenzene (PS–DVB) …

Process capability index Cpk is the most popular capability index widely used in the
manufacturing industry. Existing research on the yield‐based measure index Cpk to date is …

The force–resistance relationship is investigated by considering for the first time the effect of
size distribution of metallic filler particles in anisotropic conductive adhesives. It is shown, for …