Wafer map failure pattern recognition and similarity ranking for large-scale data sets

MJ Wu, JSR Jang, JL Chen - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Wafer maps can exhibit specific failure patterns that provide crucial details for assisting
engineers in identifying the cause of wafer pattern failures. Conventional approaches of …

Wafer map defect patterns classification using deep selective learning

MB Alawieh, D Boning, DZ Pan - 2020 57th ACM/IEEE Design …, 2020 - ieeexplore.ieee.org
With the continuous drive toward integrated circuits scaling, efficient yield analysis is
becoming more crucial yet more challenging. In this paper, we propose a novel …

Apparatus and methods for detecting overlay errors using scatterometry

WD Mieher, A Levy, B Golovanesky… - US Patent …, 2008 - Google Patents
Disclosed are techniques, apparatus, and targets for deter mining overlay error between two
layers of a sample. In one embodiment, a method for determining overlay between a …

Methods and apparatus for data analysis

E Miguelanez, MJ Scott, J Gorin, P Buxton… - US Patent …, 2008 - Google Patents
(54) METHODS AND APPARATUS FOR DATA G06N 3/12(2006.01) ANALYSIS(52) US
Cl............................ 702/108: 714/26: 706/13 (58) Field of Classification Search …

Apparatus and methods for detecting overlay errors using scatterometry

WD Mieher, A Levy, B Golovanesky… - US Patent …, 2007 - Google Patents
Disclosed is a method for determining an overlay error between at least two layers in a
multiple layer sample. A sample having a plurality of periodic targets that each have a first …

Silicon wafer map defect classification using deep convolutional neural network with data augmentation

A Shawon, MO Faruk, MB Habib… - 2019 IEEE 5th …, 2019 - ieeexplore.ieee.org
Wafer map defect classification is one of the most important process for semiconductor
manufacturing. Wafer map defects are also cause of die failures. So, we propose a better …

Methods and apparatus for data analysis

PM Buxton, EP Tabor, EM Martin… - US Patent 7,225,107, 2007 - Google Patents
US7225107B2 - Methods and apparatus for data analysis - Google Patents US7225107B2 -
Methods and apparatus for data analysis - Google Patents Methods and apparatus for data …

Enhanced Deep Convolutional Neural Network for Identifying and Classification of Silicon Wafer Faults in IC Fabrication Industries

GC Ram, MV Subbarao, DR Varma… - … Signal Processing and …, 2023 - ieeexplore.ieee.org
This paper presents the detection and classification of various manufacturing defects on
wafer maps using an enhanced deep convolutional neural network (DCNN). Wafers are tiny …

[PDF][PDF] Inspection in semiconductor manufacturing

KW Tobin - Webster's Encyclopedia of Electrical and Electronic …, 1999 - Citeseer
In-line microscopy must keep up with the flow of manufacturing. At an inspection point, of
which there are several in the process stream, a fraction of the wafers will be inspected …

Apparatus and methods for detecting overlay errors using scatterometry

WD Mieher, A Levy, B Golovanevsky… - US Patent …, 2007 - Google Patents
Disclosed is a method of determining an overlay error between two layers of a multiple layer
sample. For each of a plurality of periodic targets target that each have a first structure …