Numerous technological advancements in the 21st century depend on the creation of novel
materials possessing enhanced properties; there is a growing reliance on materials that can …

Aiming to solve the intrinsic brittleness of Sn–Bi solder alloy, the effects of In element on the
microstructure evolution, mechanical and soldering properties were systematically …

Sn–Bi solder is considered a promising lead-free solder which meets the performance
requirements with the advantages of low melting point, good wettability and mechanical …

The effect of Cu addition on potentiodynamic and static immersion corrosion behavior of Sn-
9Zn-xCu (x= 0, 1, 2, 3 wt%) was evaluated for their application in the electronic industry …

Zn-Al alloy with the addition of Al (5–25 wt.%) was fabricated into as–cast and rod–shaped
alloys. SEM/EDS and XRD technology were used to examine the impacts of the Al–element …

The objective of this research is to investigate the role of Sb addition on the microstructure
and creep behaviors of the Sn–6.5 Zn–0.3 Cu solder alloy. Concerning microstructure …

The microstructure, interfacial intermetallic compounds (IMCs) and shear property of Sn-9Zn
and Sn-9Zn-30Cu composite solder joints during thermal cycling were studied (Cu is the …

A key factor in ensuring the service life of microelectronic devices is the creep and thermal
characteristics of alloys. As a result, the present work aims to develop the creep features and …

Reference Page 1 Reference Page 2 References [1] H. Ma and J. Suhling, “A review of
mechanical properties of lead-free solders for electronic packaging,” J. Mater. Sci., vol. 44, pp …