Operation Up to 500 °C of Al0.85Ga0.15N/Al0.7Ga0.3N High Electron Mobility Transistors

PH Carey, F Ren, AG Baca, BA Klein… - IEEE Journal of the …, 2019 - ieeexplore.ieee.org
AlGaN channel high electron mobility transistors (HEMTs) are the potential next step after
GaN channel HEMTs, as the high aluminum content channel leads to an ultra-wide …

Gate-induced drain leakage reduction in cylindrical dual-metal hetero-dielectric gate all around MOSFET

S Rewari, V Nath, S Haldar, SS Deswal… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, an analytical model of dual-metal hetero-dielectric (DM-HD) cylindrical gate all
around (GAA) MOSFET has been proposed to address and solve a substantial issue of gate …

Shallow extension engineered dual material surrounding gate (SEE-DM-SG) MOSFET for improved gate leakages, analysis of circuit and noise performance

A Goel, S Rewari, S Verma, RS Gupta - AEU-International Journal of …, 2019 - Elsevier
The leakages in off state, particularly Gate Induced Drain Leakage (GIDL) has been
addressed and reduced by proposing a Shallow Extension Engineered Dual Material …

Low power zinc-oxide based charge trap** memory with embedded silicon nanoparticles via poole-frenkel hole emission

N El-Atab, A Ozcan, S Alkis, AK Okyay… - Applied Physics …, 2014 - pubs.aip.org
A low power zinc-oxide (ZnO) charge trap** memory with embedded silicon (Si)
nanoparticles is demonstrated. The charge trap** layer is formed by spin coating 2 nm …

Reduction of interface traps at the amorphous-silicon/crystalline-silicon interface by hydrogen and nitrogen annealing

A Alnuaimi, K Islam, A Nayfeh - Solar Energy, 2013 - Elsevier
We show a reduction in the interface trap density (D it) at the amorphous-silicon/crystalline-
silicon interface by annealing in nitrogen (95%) and hydrogen (5%) for 10, 20 and 25 min at …

Impact of Ge Preamorphization Implantation on Both the Formation of Ultrathin TiSix and the Specific Contact Resistivity in TiSix/n-Si Contacts

S Mao, G Wang, J Xu, X Luo, D Zhang… - … on Electron Devices, 2018 - ieeexplore.ieee.org
In this paper, the impact of different Ge preamorphization implantation (PAI) conditions on
the formation of ultrathin TiSi x as well as on the specific contact resistivity (Pc) in TiSi x/n-Si …

Electrical characterization of SOI pMOS device leakage

D Bosch, P Lhéritier, F Guyader, S Joblot… - Solid-State …, 2023 - Elsevier
This work investigates Silicon-on-Insulator (SOI) pMOS leakage current. Temperature
measurements indicates the superposition of two leakage mechanisms: band-to-band …

[HTML][HTML] Origin of the Temperature Dependence of Gate-Induced Drain Leakage-Assisted Erase in Three-Dimensional nand Flash Memories

DG Refaldi, G Malavena, L Chiavarone, AS Spinelli… - Micromachines, 2024 - mdpi.com
Through detailed experimental and modeling activities, this paper investigates the origin of
the temperature dependence of the Erase operation in 3D nand flash arrays. First of all …

Dielectric pocket engineered, gate induced drain leakages (GIDL) and analog performance analysis of dual metal nanowire ferroelectric MOSFET (DPE-DM-NW-Fe …

S Garg, J Kaur, A Goel, S Haldar, RS Gupta - Microsystem Technologies, 2024 - Springer
This research article presents a simulation study on a dielectric pocket engineered dual
metal nanowire ferroelectric (DPE-DM-NW-Fe FET) MOSFET. The aim is to mitigate the Gate …

Investigation of retention characteristics for trap-assisted tunneling mechanism in sub 20-nm NAND flash memory

K Lee, H Shin - IEEE Transactions on Device and Materials …, 2017 - ieeexplore.ieee.org
In this paper, retention characteristics of the trap-assisted tunneling (TAT) mechanism are
investigated in sub 20-nm NAND flash memory. Total charge loss source for the TAT …