The reliability of electronics under drop-shock conditions has attracted significant interest in
recent years due to the widespread use of mobile electronic products. This review focuses …

Due to safety and reliability concerns, various classes and/or applications of electronic
products are excluded from the European Union's Restriction of Hazardous Substances …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

This manuscript presents the research studies in the drop-impact reliability of solder joints in
the PCB assemblies intended for mobile applications. The works cover stress–strain …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

This study investigated brittle solder joint failure mechanisms during high-speed solder ball
shear and pull testing. BGA package samples with different solder alloys (Sn4. 0% Ag0. 5 …

This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips
with Cu contact-pads on the front side and a die attach film on the backside are picked and …

Abstract Cu 6 Sn 5 and Cu 3 Sn are common intermetallic compounds (IMCs) found in Sn–
Ag–Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the …

Classical marker-based roentgen stereophotogrammetric analysis (RSA) is an accurate
method of measuring in vivo implant migration. A disadvantage of the method is the …