With the development of microelectronics, the demand for continuously miniaturized feature
sizes has driven continuous progress in lithography technology. Extreme ultraviolet (EUV) …

Continuous ongoing development of dense integrated circuits requires significant
advancements in nanoscale patterning technology. As a key process in semiconductor high …

The semiconductor industry has long been driven by advances in a nanofabrication
technology known as lithography, and the fabrication of nanostructures on chips relies on an …

The resolution, line edge roughness, and sensitivity (RLS) trade-off has fundamentally
limited the lithographic performance of chemically amplified resists. Production of next …

The semiconductor industry has already entered the sub-10 nm region, which has led to the
development of cutting-edge fabrication tools. However, there are other factors that hinder …

Nonchemically amplified resists based on triphenyl sulfonium triflate-modified polystyrene
(PSTS) were prepared by a facile method of modification of polystyrene with sulfonium …

In this study, a series of molecular resists based on a bis (4-butoxyphenyl) sulfone core
attached to a varying number of radiation-sensitive triphenylsulfonium units (BPSS n, where …

Recently, injectable hydrogels have attracted much interest in tissue engineering (TE)
applications because of their controlled flowability, adaptability, and easy handling …

Hybrid metal–organic cluster resist materials, also termed as organo-inorganics,
demonstrate their potential for use in next-generation lithography owing to their ability for …

Given the need for a next-generation technology node in the area of integrated circuits (ICs),
improvement in the properties of resist materials, particularly sensitivity (ED), resolution …