Reliability of the microelectronic interconnection materials for electronic packages has a
significant impact on the fatigue properties of the electronic assemblies. This is due to the …

Electronic components are complex systems consisting of a combination of different
materials, which undergo degenerative changes over time following the second law of …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

Solder joints in electronic assemblies are frequently exposed to thermal cycling
environments in their service life which causes microstructural evolution and material …

The interconnection materials that are used in electronics assembly fabrication operating in
harsh environmental conditions are frequently exposed to different types of mechanical …

In the electronic assembly arena, lead is being targeted due to the concern regarding
environmental pollutants. So, the lead-free solder and its reliability are getting highlighted …

Failure due to thermal cycling is common at the solder joint level of electronic assemblies
due to the mismatch in the coefficient of thermal expansions between the carrier and printed …

In our prior study, the degradations of the effective elastic modulus (E) and ultimate tensile
strength (UTS) of lead free solders were observed for samples subjected to isothermal aging …

To study the effect of heating temperature rise on the reliability of device solder joints, a
typical Ceramic Small Outline Package (CSOP) device was selected. A test board was …