In micro-concentrating photovoltaics (micro-CPV), the size of solar cells is reduced (< 1x1
mm 2) compared to conventional CPV. However, the quantity and requirement for placement …

Printed electronics offer great potential for new applications such as Internet of Things
devices and wearables. However, to date, only a limited number of electronic functions and …

In this paper, we introduce an automated Bayesian visual inspection framework for printed
circuit board (PCB) assemblies, which is able to simultaneously deal with various shaped …

Surface tension-driven self-alignment is a promising technique to align millimeter-scale
components with a high accuracy of a few microns. It is based on liquid capillary forces …

The objective of this research is to predict the solder joint's fillet profile before its formation.
Solder joints are crucial for the structural and operational reliability of electronic assemblies …

Motivation: As passive components' size gets smaller, quality rejects due to overhang and
misalignment after the reflow appear more frequently. This situation is partly because the …

Demand for more interconnection joints between semiconductor devices can be realized
with solder bump technology. Surface tension and density are usually material properties …

In micro-concentrating photovoltaics (micro-CPV), tiny solar cells (<1mm^2) are assembled
on a circuit board on glass. To mount thousands of dies per square meter, a high throughput …

In the mass assembly of today's electronic circuits, solder paste is first printed onto the
surface of the assembly boards through a metal mask called a stencil. The possible surface …

In this paper, the complex heat transfer process of the vapour phase soldering has been
investigated on the level of electronic components. VPS is gaining increased attention lately …