Because failures in lead-free solder joints occur at locations other than the most highly shear-
strained regions, reliability prediction is challenging. To gain physical understanding of this …

In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6
SiC/Cu solder under isothermal aging (50, 100, 150, 200 and 250 h) and thermal cycling …

The interaction between isothermal aging and the long-term reliability of fine-pitch ball grid
array (BGA) packages with Sn-3.0 Ag-0.5 Cu (wt.%) solder ball interconnects was …

Tin-based alloys are commonly used in lead-free solder joints in electronic interconnection
applications, where creep can limit joint reliability. In this work, directionally solidified bulk …

To elaborate deformation and fracture behavior of Sn3. 0Ag0. 5Cu/Cu solder joint, dynamic
shear testing was designed and performed on as-reflowed and aged solder joints which …

Thermally cycled plastic ball grid array (PBGA) packages with full arrays of 196 solder joints
after various preconditions were examined to observe the microstructure evolution of Sn-Ag …

Lead-free tin-based solder joints often have a single-grained structure with random
orientation and highly anisotropic properties. These alloys are typically stiffer than lead …

The potential of cobalt substrates to control the microstructure of 550 μm Sn-3Ag-0.5 Cu ball
grid array (BGA) joints is explored. It is shown that cobalt substrates give a small and …

Abstract Uniaxial compression tests of 99.9% pure polycrystalline β-tin (Sn) were conducted
at various strain rates (10− 3/s, 10− 1/s and 1/s) and temperatures (294 K and 193 K) to …

Since 2006 and the implementation of environmental regulations, the electronic industry has
moved to Pb-free solders. Harsh environment industries that were exempted from the …