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Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies
Optical links are moving to higher and higher transmission speeds while shrinking to shorter
and shorter ranges where optical links are envisaged even at the chip scale. The scaling in …
and shorter ranges where optical links are envisaged even at the chip scale. The scaling in …
Recent progress of integrated circuits and optoelectronic chips
Integrated circuits (ICs) and optoelectronic chips are the foundation stones of the modern
information society. The IC industry has been driven by the so-called “Moore's law” in the …
information society. The IC industry has been driven by the so-called “Moore's law” in the …
Silicon photonics for high-capacity data communications
In recent years, optical modulators, photodetectors,(de) multiplexers, and heterogeneously
integrated lasers based on silicon optical platforms have been verified. The performance of …
integrated lasers based on silicon optical platforms have been verified. The performance of …
Integrated photonics packaging: challenges and opportunities
Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before
they can be integrated into functional optoelectronic systems. Photonic packaging is …
they can be integrated into functional optoelectronic systems. Photonic packaging is …
1.6 Tbps silicon photonics integrated circuit and 800 Gbps photonic engine for switch co-packaging demonstration
We describe the performance of high bandwidth-density silicon photonic based integrated
circuits (SiPh ICs) that enable the first fully functional photonic engine (PE) module co …
circuits (SiPh ICs) that enable the first fully functional photonic engine (PE) module co …
Co-packaged optics (CPO): status, challenges, and solutions
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …
Co-packaged photonics for high performance computing: status, challenges and opportunities
R Mahajan, X Li, J Fryman, Z Zhang… - Journal of Lightwave …, 2021 - ieeexplore.ieee.org
Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …
potential to deliver significant improvements in power, bandwidth and reach needed to meet …
Scaling capacity of fiber-optic transmission systems via silicon photonics
The tremendous growth of data traffic has spurred a rapid evolution of optical
communications for a higher data transmission capacity. Next-generation fiber-optic …
communications for a higher data transmission capacity. Next-generation fiber-optic …
Scaling up silicon photonic-based accelerators: Challenges and opportunities
Digital accelerators in the latest generation of complementary metal–oxide–semiconductor
processes support, multiply, and accumulate (MAC) operations at energy efficiencies …
processes support, multiply, and accumulate (MAC) operations at energy efficiencies …
Chip-scale frequency combs for data communications in computing systems
Recent developments in chip-based frequency-comb technology demonstrate that comb
devices can be implemented in applications where photonic integration and power …
devices can be implemented in applications where photonic integration and power …