Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …

Most micro-electro-mechanical systems (MEMS) devices contain fragile moving parts, which
poses challenges in process integration of interconnection methods requiring wet-chemistry …

Fabrication, characterization, and thermomechanical reliability of electroplated Cu-Sn-Cu-
based transient liquid phase (TLP) bonding required in microsystems packaging are …

Abstract Design and fabrication of the through-glass via (TGV) based three-dimensional
(3D) spiral inductors in the fused silica substrates by a simpler electrochemical discharge …

Solid-liquid interdiffusion (SLID) bonding is one of the most promising novel methods for
micro-(opto)-electromechanical system (MEMS/MOEMS) wafer-level packaging. However …

Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of
electronic packaging. This research used the immersion method to study the dissolution …

Abstract Effect of surface roughness on the void formation and intermetallic compounds
(IMCs) growth in the Cu-Sn diffusion layers is reported. Different samples having varying …

This paper reports the intermetallic growth and microvoid formation in the Cu–Sn layers,
which were annealed at low temperatures (sub-200° C) for durations varying from 120 to …

In recent years, the usage of glass-based materials as substrate in radio-frequency (RF)
micro-electro-mechanical-systems (MEMS) applications has increased. Compared to silicon …