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[HTML][HTML] Microstructure and properties of electromigration of Sn58Bi/Cu solder joints with different joule thermal properties
Y Gao, K Zhang, C Zhang, Y Wang, W Chen - Metals, 2023 - mdpi.com
Electromigration is one of the most important research issues affecting the reliability of
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …