Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …

Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …

This work investigates the effects of nano-Al2O3 on the microstructure and microhardness of
the Sn3. 5Ag0. 5Cu composite solder alloy. In comparison with solder without the addition of …

For development of a lead-free composite solder for advance electrical components, a
series of Sn3. 5Ag0. 25Cu (SAC) solders containing TiO2 nanopowders have been studied …

The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307
solder paste was investigated on the thermal and microstructural properties of the composite …

The main joining process of the electronic industry is still soldering with different alloys of Sn.
This work studied the relationship between Sn whisker growth and corrosion resistance of …

Composites of SC solder reinforced with 0, 0.25, 0.5 and 1wt.% of TiO2 nanoparticles were
fabricated using a mechanical technique. With increased addition of TiO2 nanoparticles, the …

The properties of Sn99Ag0. 3Cu0. 7 (SACX0307) solder alloy reinforced with ZnO
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …

Interconnect formation is critical for the assembly and integration of nanocomponents to
enable nanoelectronics‐and nanosystems‐related applications. Recent progress on joining …

In this research, creep properties and thermal behavior of Sn-3.5 Ag-0.7 Cu (SAC)/multi-
walled carbon nanotubes (MW-CNTs) lead-free nanocomposite solders was studied by …