Power electronics based on wide-bandgap semiconductors: Opportunities and challenges

G Iannaccone, C Sbrana, I Morelli, S Strangio - IEEE access, 2021‏ - ieeexplore.ieee.org
The expansion of the electric vehicle market is driving the request for efficient and reliable
power electronic systems for electric energy conversion and processing. The efficiency, size …

LLC resonant converter topologies and industrial applications—A review

J Zeng, G Zhang, SS Yu, B Zhang… - Chinese Journal of …, 2020‏ - ieeexplore.ieee.org
Owing to the advantages of high efficiency, high energy density, electrical isolation, low
electromagnetic interference (EMI) and harmonic pollution, magnetic integration, wide …

[HTML][HTML] Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

Y Sun, X Kang, Y Zheng, J Lu, X Tian, K Wei, H Wu… - Electronics, 2019‏ - mdpi.com
Gallium nitride (GaN)-based vertical power Schottky barrier diode (SBD) has demonstrated
outstanding features in high-frequency and high-power applications. This paper reviews …

Role of threshold voltage shift in highly accelerated power cycling tests for SiC MOSFET modules

H Luo, F Iannuzzo, M Turnaturi - IEEE Journal of Emerging and …, 2019‏ - ieeexplore.ieee.org
In silicon carbide (SiC) power MOSFETs, threshold voltage instability under high-
temperature conditions has potential reliability threats to long-term operation. In this paper …

Quantified density of performance-degrading near-interface traps in SiC MOSFETs

M Chaturvedi, S Dimitrijev, D Haasmann… - Scientific reports, 2022‏ - nature.com
Abstract Characterization of near-interface traps (NITs) in commercial SiC metal–oxide–
semiconductor field-effect transistors (MOSFETs) is essential because they adversely impact …

[HTML][HTML] Leakage and breakdown mechanisms of GaN vertical power FinFETs

M **ao, X Gao, T Palacios, Y Zhang - Applied physics letters, 2019‏ - pubs.aip.org
This work studies the leakage and breakdown mechanisms of 1.2 kV GaN vertical power
FinFETs with edge termination. Two competing leakage and breakdown mechanisms have …

Active defects in MOS devices on 4H-SiC: A critical review

HA Moghadam, S Dimitrijev, J Han… - Microelectronics …, 2016‏ - Elsevier
The state-of-the-art 4H-SiC MOSFETs still suffer from performance (low channel-carrier
mobility and high threshold voltage) and reliability (threshold voltage instability) issues …

Bias temperature instability in SiC metal oxide semiconductor devices

C Yang, S Wei, D Wang - Journal of physics D: applied physics, 2021‏ - iopscience.iop.org
Although silicon carbide (SiC) metal oxide semiconductor field-effect transistors (MOSFETs)
are commercially available, bias temperature instability (BTI) defined as shifts in V th in SiC …

[HTML][HTML] Analysis of the reverse IV characteristics of diamond-based PIN diodes

M Saremi, R Hathwar, M Dutta, FAM Koeck… - Applied Physics …, 2017‏ - pubs.aip.org
Diamond is one of the most promising candidates for high power and high temperature
applications, due to its large bandgap and high thermal conductivity. As a result of the …

Single β-Ga2O3 nanowire based lateral FinFET on Si

S Xu, L Liu, G Qu, X Zhang, C Jia, S Wu, Y Ma… - Applied Physics …, 2022‏ - pubs.aip.org
A fin field-effect transistor (FinFET) based on single β-Ga 2 O 3 nanowire with a diameter
of∼ 60 nm transferred to Si substrate is demonstrated. The FinFET device shows good …