A systematic approach for inductance extraction for via arrays between two parallel planes is
presented. Both self and mutual inductance values are obtained based on a cavity model …

As an integrated circuit (IC) package, ball grid arrays (BGA) are widely used in various
electronic systems, playing an important role in energy transfer and electrical signal …

Exact and consistent modeling of circularly shaped ports in the power/ground plane analysis
under the assumption of isotropic excitations is addressed in this paper. Novel expressions …

Via transitions in high-speed channels critically influence the signal integrity and power
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …

As the radiation leakage from solder balls of system-in-package becomes increasingly
significant, this article presented a novel analysis and design method for pin map distribution …

A discontinuous Galerkin time-domain (DGTD) method analyzing signal/power integrity on
multilayered power-ground parallel plate pairs is proposed. The excitation is realized by …

This paper studies the accuracy of the physics-based via model, specifically when applied to
dense via arrays. The physics-based model uses Green's functions for cylindrical waves in …

The ball grid array (BGA) structure is the interconnection between package to printed circuit
board and the discontinuity from BGA affects the performance for the whole link path in the …

Rigorous analysis of via-plate-pair interactions requires the impedance of a plate pair to be
defined in terms of radial transmission lines on perfect magnetic conductor (PMC) ports. The …

Electrical properties of dielectric substrate are critical in designing high-speed products in
terms of signal and power integrity. It is important to accurately characterize the dielectric …