The frictional receding contact problem for two graded layers pressed by a rigid punch is
considered in this paper. The punch is subjected to both normal and tangential loads …

We consider in this paper the fully coupled contact problem between a rigid cylinder and a
functionally graded coating bonded to a homogeneous substrate system under plane strain …

A theoretical model of a thin piezoelectric film bonded to a graded substrate under an in-
plane electrical loading is established, in which the shear modulus of the graded substrate is …

Three-dimensional fretting contacts involving multilayered or functionally graded materials
are commonly seen in mechanical systems. The analyses of surface fatigue and contact …

A theoretical model of a thin piezoelectric actuator attached to a graded half plane with an
adhesive layer under an electrical loading is analyzed in the present paper. The shear …

Contact behavior of a rigid cylindrical punch sliding on an elastically graded half-plane with
shear modulus gradient variation in an arbitrary direction is investigated. The governing …

In this paper, the contact problem of an elastoplastic functionally graded substrate and a
rigid spherical indenter is investigated using finite element method. For the first time, the …

The coupling problem of a cracked neo-Hookean substrate with initial stress under a rigid
punch is examined in the current work. Fourier series is used to transform the mixed …

Contact problem on indentation of an electroelastic piezoelectric half-space by a rigid
spherical conductive punch is considered. The half-space consists of a functionally graded …

This paper analyzes the adhesive nanocontact properties between a rigid cylinder and an
exponentially graded coating-substrate structure. While adhesion between the indenter and …