Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review

T Zhan, M Xu, Z Cao, C Zheng, H Kurita, F Narita… - Micromachines, 2023 - mdpi.com
Wide-bandgap gallium nitride (GaN)-based semiconductors offer significant advantages
over traditional Si-based semiconductors in terms of high-power and high-frequency …

Cryogenic CMOS for quantum processing: 5-nm FinFET-based SRAM arrays at 10 K

SS Parihar, VM Van Santen, S Thomann… - … on Circuits and …, 2023 - ieeexplore.ieee.org
In this work, we are the first to investigate and model the characteristics of a commercial 5nm
FinFET technology from room temperature (300K) all the way down to cryogenic …

FinFET to GAA MBCFET: A Review and Insights

RR Das, TR Rajalekshmi, A James - IEEE Access, 2024 - ieeexplore.ieee.org
This review article presents a journey from Fin-shaped field effect transistor (FinFET) to gate-
all-around multi-bridge channel field effect transistor (GAA MBCFET) technology, unraveling …

Transistor self-heating-aware synthesis for reliable digital circuit designs

F Klemme, H Amrouch - … Transactions on Circuits and Systems I …, 2023 - ieeexplore.ieee.org
With the continuous scaling in technology nodes, the transistor self-heating effect (SHE)
emerges as a growing threat to circuit reliability. Increasingly confined transistor structures …

Upheaving self-heating effects from transistor to circuit level using conventional eda tool flows

F Klemme, S Salamin… - 2023 Design, Automation & …, 2023 - ieeexplore.ieee.org
In this work, we are the first to demonstrate how well-established EDA tool flows can be
employed to upheave Self-Heating Effects (SHE) from individual devices at the transistor …

Special session: Machine learning for semiconductor test and reliability

H Amrouch, AB Chowdhury, W **… - 2021 IEEE 39th VLSI …, 2021 - ieeexplore.ieee.org
With technology scaling approaching atomic levels, IC test and diagnosis of complex System-
on-Chips (SoCs) become overwhelming challenging. In addition, sustaining the reliability of …

TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores

S Chakraborty, Y Sharma, S Moulik - ACM Transactions on Embedded …, 2024 - dl.acm.org
The recent shift in the VLSI industry from conventional MOSFET to FinFET for designing
contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms' …

STIFF: thermally s afe t emperature effect i nversion aware F in F ET based multi-core

S Chakraborty, V Soteriou, M Själander - Proceedings of the 19th ACM …, 2022 - dl.acm.org
FinFET, a non-planar device, has become the prevalent choice for chip-multiprocessor
(CMP) designs due to its lower leakage and improved scalability as compared to planar …

ML to the rescue: Reliability estimation from self-heating and aging in transistors all the way up processors

H Amrouch, F Klemme - Proceedings of the 28th Asia and South Pacific …, 2023 - dl.acm.org
With increasingly confined 3D structures and newly-adopted materials of higher thermal
resistance, transistor self-heating has risen to a critical reliability threat in state-of-the-art and …

Impact of self-heating on performance, power and reliability in finfet technology

VM van Santen, PR Genssler, O Prakash… - 2020 25th Asia and …, 2020 - ieeexplore.ieee.org
Self-heating is one of the biggest threats to reliability in current and advanced CMOS
technologies like FinFET and Nanowire, respectively. Encapsulating the channel with the …