Recent progress in ohmic contacts to silicon carbide for high-temperature applications

Z Wang, W Liu, C Wang - Journal of Electronic Materials, 2016 - Springer
During the past few decades, silicon carbide (SiC) has emerged as the most promising wide-
bandgap semiconductor for high-temperature, high-frequency, and high-power applications …

Ni‐Based Ohmic Contacts to n‐Type 4H‐SiC: The Formation Mechanism and Thermal Stability

AV Kuchuk, P Borowicz, M Wzorek… - … in Condensed Matter …, 2016 - Wiley Online Library
The fabrication of low‐resistance and thermal stable ohmic contacts is important for
realization of reliable SiC devices. For the n‐type SiC, Ni‐based metallization is most …

Thermal stability of the current transport mechanisms in Ni-based Ohmic contacts on n-and p-implanted 4H-SiC

M Vivona, G Greco, F Giannazzo… - Semiconductor …, 2014 - iopscience.iop.org
Studying the temperature dependence of the electrical properties of Ohmic contacts formed
on ion-implanted SiC layers is fundamental to understand and to predict the behaviour of …

The thermal stability study and improvement of 4H-SiC ohmic contact

S Liu, Z He, L Zheng, B Liu, F Zhang, L Dong… - Applied Physics …, 2014 - pubs.aip.org
The thermal stability of the standard Ni/SiC and a TiW/Ni/SiC Ohmic contacts was
investigated and compared after being aged at 400 C in the N 2 atmosphere. The Ohmic …

Bias-temperature instabilities in 4H-SiC metal–oxide–semiconductor capacitors

EX Zhang, CX Zhang, DM Fleetwood… - … on Device and …, 2012 - ieeexplore.ieee.org
Bias-temperature instabilities (BTIs) are investigated for n-and p-substrate 4H-SiC metal–
oxide–semiconductor (MOS) capacitors. The midgap voltage (V_\rmmg) shifts positively …

Photoelectric, optical and microstructural characterization of thin palladium silicide (Pd2Si) layers fabricated by magnetron sputtering from a stoichiometric target

K Piskorski, M Wzorek, M Ekielski, L Dobrzański… - Materials Science and …, 2022 - Elsevier
The properties of thin Pd 2 Si layers fabricated by means of magnetron sputtering deposition
from a stoichiometric target was examined. Optical parameters were determined using …

[HTML][HTML] Electrical properties of Cu/Pd2Si Schottky contacts to AlGaN/GaN-on-Si HEMT heterostructures

M Wzorek, M Ekielski, E Brzozowski, A Taube - Materials Science in …, 2023 - Elsevier
In this study, we analyze gold-free Cu/Pd 2 Si Schottky contacts to AlGaN/GaN-on-Si HEMT
(high electron mobility transistor) heterostructures. The silicide layers are fabricated through …

Ni/W/Ni ohmic contacts for both n-and p-type 4H-SiC

D Bae, G Ahn, C Jeong, K Kim - Electrical Engineering, 2018 - Springer
In this study, we used a Ni/W/Ni-layered structure to provide low-resistive ohmic contacts
with good thermal stability for both n-type and p-type 4H-SiC. As reference, we used Ni and …

Improved microstructure and ohmic contact of Nb electrode on n-type 4H-SiC

K Jung, Y Sutou, J Koike - Thin Solid Films, 2012 - Elsevier
Niobium was deposited as an electrode material on an n-type SiC wafer for power device
application. The reaction microstructure and electrical contact property were investigated …

Thermal degradation of Au/Ni2Si/n-SiC ohmic contacts under different conditions

AV Kuchuk, M Guziewicz, R Ratajczak… - Materials Science and …, 2009 - Elsevier
The thermal degradation of Au/Ni2Si/n-SiC ohmic contact was investigated after long-time
aging in air at 400° C or rapid thermal annealing in Ar up to 700° C. Current–voltage …